In the afternoon of October 24, the 3-day 2021 Beijing International Symposium on Microelectronics and IC WORLD Conference came to an end at Beijing Yichuang International Convention and Exhibition Center.

On Oct. 23, Chen Xiaonan, Deputy Director and Grade 1 Inspector of Beijing Economic and Technological Development Area (BETDA), visited the booth of Jiangfeng Electronics, and expressed his full affirmation of the achievements of Jiangfeng Electronics, and said that the overall IC industry in BETDA has shown a promising trend of vigorous development, and the scale and competitiveness of the industry has been greatly enhanced. The scale and competitiveness of the industry has been greatly enhanced, and now it has brought together the circuit industry cluster covering design and manufacturing, tooling, testing, equipment, parts and materials, with SMIC and North Huachuang as the leaders. It is planned to comprehensively build an IC industry ecological highland with global competitive advantages, and strive to build an industry benchmark with three major features: high specification, great integration, and industry chain collaborative innovation.

During the exhibition, KFMI actively participated in the discussion of several technical sub-forums. In the morning of October 24, "IC Material Development and Opportunities in the 'Core' Era" technical forum, Zuo Wei, deputy general manager of CMP business unit, made a keynote speech of "Focus on Customer Needs - CMP Material Solutions" on behalf of the company. -CMP material solutions".

In the technical forum of "IC core parts discussion" in the morning of October 24, Zan Xiaolei, general manager of the Parts Division, made a keynote speech of "Embracing opportunities and challenges, strengthening the foundation for win-win cooperation" on behalf of the company. Key components are important "neck" issues in the main equipment of semiconductor core process, KFMI has solved the problems in materials, processing, surface treatment, analysis and testing, customization services, etc., and made outstanding contributions to the localization of IC core components.