1、Grain orientation control technology
The size and orientation of the grains directly determine the uniformity of the sputtering film and the sputtering speed, affecting the quality and performance of downstream products. The company has metal material plastic deformation processing line and internal structure testing equipment, through the scientific process arrangement, can implement precise control of grain grain orientation.
2、High purity metal purity control and purification technology
Since impurities in metal materials can affect the conductivity of downstream products such as semiconductor chips, sputtering targets place considerable demands on the purity of metal materials. Through independent research and development and cooperative development, the company has the technical capability to produce ultra-high purity metal materials for sputtering targets, which greatly enhances the market competitiveness of the company.
3、Large area welding technology for dissimilar metals
Welding technology is the technology to firmly weld the target blank and the backing plate together. The company has complete production lines and advanced technology for different welding methods such as diffusion welding, electron beam welding and brazing, etc. The average welding bonding rate of the products can reach over 99%, which can meet the diversified needs of different customers. Through years of independent research and development, the company has mastered the diffusion welding technology of Al, Ti, Ta, Cu and other different target materials and different backing materials in large size, high bonding rate and high strength, and many diffusion welding technologies have reached the international leading level.
4、Precision machining and special treatment technology for metals
The sputtering machines used by semiconductor chip manufacturing customers are very precise and require high dimensional accuracy of sputtering targets. The company has a number of top domestic and foreign CNC lathes, machining centres and other large precision processing equipment, which can accurately control the various dimensions of the targets, thus meeting the requirements of different high-end customers worldwide for the use of sputtering machines.
5、Cleaning and packaging technology for targets
The production environment of downstream customers and the cavity of the sputtering reaction machine require a high degree of cleanliness of sputtering targets. The company uses its own designed automatic target cleaning machine to repeatedly clean the products and dry them in a vacuum environment, so that the surface cleanliness of sputtering targets used for the production of semiconductor chips can reach the electronic grade level.
KFMI insists on science and technology as the driving force of innovation, focuses on independent research and development, and has complete independent intellectual property rights. The company has undertaken scientific research and industrialization projects such as National 02 Major Special Project, National 863 Major Special Project, High Technology Industrialization Project of Development and Reform Commission, and Electronic Development Fund of the Ministry of Industry and Information Technology. Up to now, the company has applied for 628 patents, 570 invention patents, formulated 15 national/industry technical standards, and ranked 365th among the top 500 Chinese enterprises in terms of patents. The company and its products have been awarded as "National Intellectual Property Advantage Enterprise", "National Manufacturing Single Champion Demonstration Enterprise", "Top 10 Chinese Semiconductor Material Enterprise", "National Strategic Innovation Product" and "National Intellectual Property Advantage Enterprise". "National Strategic Innovation Product", "China Semiconductor Innovative Product and Technology Award", "Zhejiang Province Science and Technology Significant Contribution Award", " First Prize of Scientific and Technological Invention of Zhejiang Province", "Zhejiang Export Famous Brand Product", etc. Some of the scientific and technological achievements have participated in the national "Eleventh Five-Year Plan" and "Twelfth Five-Year Plan" major scientific and technological achievements exhibition, and the company has taken the lead and developed key equipment for target production and testing by domestic equipment manufacturers, realizing the localization of production lines.
1. National 02 Science and Technology Major Project of the 13th Five-Year Plan
The project of "Industrialization technology of ultra-high purity metal materials for integrated circuit targets" was included in the major special project of the Ministry of Science and Technology of the People's Republic of China for supporting equipment and processes for very large-scale integrated circuits.
2.National 02 Science and Technology Major Project of the 13th Five-Year Plan "20-14nm Pilot Product Process Development" Project
The "20-14nm Pilot Product Process Development" project was included in the Ministry of Science and Technology of the People's Republic of China's Ministry of Science and Technology's Major Project on Very Large Scale IC Supporting Equipment and Processes.
3.National Strategic Emerging Industries Development Special Fund Scheme
The project of "industrialization of 10,000 high line generation flat panel displays and targets for advanced packaging" was included in the national strategic emerging industries development special fund plan.
4. National Electronic Information Industry Development Fund Project
The project "Industrialisation of aluminium and tantalum sputtering targets for PVD manufacturing of ultra-large scale integrated circuits" was included in the project of the Electronic Information Industry Development Fund of the State Ministry of Industry and Information Technology.
5. National 02 Science and Technology Major Project of the 12th Five-Year Plan
The project "Development and industrialization of ultra-high purity series sputtering targets for 45-28nm wiring" was included in the Ministry of Science and Technology of the People's Republic of China's major special project on supporting equipment and processes for very large scale integrated circuits.
6. National High Technology Research and Development Program (863 Program)
The National High Technology Research and Development Programme (NHRDP) "Research on Key Material Technologies for the Industrialisation of Aluminium and Tantalum Sputtering Targets for the Manufacture of Ultra-Scale Integrated Circuits" was included in the NHRDP.
"Manufacturing technology of ultra-high purity aluminum targets for thin film liquid crystal displays", included in the key projects of the National High Technology Research and Development Program
7. Eleventh Five-Year Plan National 02 Science and Technology Major Project
The project "Research and Development of Al, Ti and Ta Target Manufacturing Technology for 300mm Very Large Scale Integrated Circuit" was included in the 11th Five-Year Plan of the Ministry of Science and Technology of China.
8. Annual production capacity of 5,000 targets for large-size LCDs
Listed in the national color TV industry strategic transformation industrialization special
9.Industrialisation of high purity molybdenum and aluminium targets for new flat panel displays
Listed in the National Industrial Strengthening Project
10. Technical transformation project of the production line of sputtering targets for the manufacture of 20,000 ultra-large scale integrated circuits and flat panel displays per year
Included in the national electronic information industry technology transformation project
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